As part of the continuous effort to rebrand ourselves, TTS Group is pleased to announce that our Pin Assembly facility in Thailand, has changed its name from Granvision Manufacturing Co., Ltd. (GMC) to Test Tooling Solutions (Thailand) Co., Ltd. with effect from 1st Nov 2017. TTS Group is committed to strengthening our services to provide leading test and tooling solutions for end-user customers in the semiconductor industry.
SEMICON Taiwan 2017 was a rewarding experience once again for TTS Group. We thank all those for visiting and showing interest in our test and tooling solutions. The 3 days event in Taipei, gave us an opportunity to share our capability and showcase our services. We have many fruitful discussions with visitors that revolved around our solutions range of probe pins and test sockets for IoT and Sensor chips, requiring high speed and high frequency application. Do contact us at This email address is being protected from spambots. You need JavaScript enabled to view it. if we can be of further assistance.
Thank you to all who have visited our Booth at the recent BiTS China 2017 event in Shanghai, China. This is the 3rd consecutive year that we have partnered with BiTS China as a Premier Sponsor for this annual event. We appreciate the opportunity to meet, network and discuss your test and tooling solutions needs. Our sales team will be following up with you on your requests. Thank you everyone for your support at our Booth.
Our employees in Johor took a break from their work to watch "Valerian and the City of a Thousand Planets" sponsored by the Company. The movie event is one of the Company's Employee Engagement activities, to bond and strengthen our sense of belonging. Our employees were also treated to a light snack of popcorn combo set at the movie.
TTSG is honoured to have two staff to share some of our simulation knowledge at the BiTS Workshop 2017 in Arizona. Our Senior Thermal Engineer explained on her posters entitled “Introduction of Thermal Interface Material (TIM) in Thermal Management Solution” in the Poster presentation session. Another, Staff FEA & CFD Simulation Engineer presented a technical paper entitled “Applying FEA Simulation for Test Interface Unit” in the Technical Sharing session. The aim of both presentations is to share the simulation capability of TTSG. For further queries about TTSG test tooling solutions, please contact us at This email address is being protected from spambots. You need JavaScript enabled to view it.. You can follow us on our Facebook and Twitter.