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Package Info
Package Type
*
BGA
LGA
QFN
QFP
PGA
DFN
WLCSP
Cmos Image Sensor
Other
Other (Please specify)
Package Pitch
*
0.2
0.3
0.35
0.4
0.5
0.6
0.65
0.7
0.8
0.9
1.0
Other
Other (Please specify)
External Size [X*Y] (mm)
*
Ball/Pad/Pin/Lead Count
*
Solder Ball/Pad/Pin/Lead Material
Electrical Requirement
Test Frequency (GHz)
*
Pin Contact Resistance (mohms)
Other (Please specify)
Testing Requirement
Operating Temperature (°C)
*
Power Consumption (Watt)
Application Info
Test Socket
*
Semiconductor Test Socket
Kelvin Socket
POP Socket
WLCSP
RF Socket
Multi Test Site Socket
Type
*
Not Applicable
Screw On
Latch On
Turner Latch On
Lever Latch On
Lever High Force
Propose by TTS
Clamshell
*
Yes
No
Heatsink
*
Yes
No
Thermal Solution
*
No
Fan
Heatpipe
Propose by TTS
General Info
PCB Thickness
*
HVM/Engineering use
*
HVM
Engineering use
Both
Special Requirement
Message
Customer Info
Customer Information
Company
*
Address
*
Requestor Name
*
Requestor Position
*
Mobile
*
Email
*
Other Contact Method
Message
Quote Info
Test Socket (Qty)
*
Hand Socket Lid (Qty)
*
Stiffener (Qty)
*
Other 1
Other 2
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