Our WLCSP Socket (AKA probe head) is ideal for wafer level testing and is a cost-effective testing solution. As a precision-level testing product, you will be able to use this product for all small and specific tests.
TTS Group is able to design and manufacture a range of WLCSP sockets suited for a variety of smaller devices. With assured high performance for a number of applications, our probe heads are quality investment for achieving high bandwidth, low contact resistance, longer life and high reliability.
At TTS, we believe in leading the testing solution industry by offering innovative and advanced - solutions. We do not only offer the latest technology in our solution, but also take pride in a customer-driven company that believes in creativity and productivity. We value our partnerships and believe in creating a collaborative environment that allows clients and workers to get the most from their work. Choose a team that holds the same values of precision, quality and cooperation, and see how we can help increase and improve your productivity. Whatever the testing solutions you require, we are readily available to provide you with the products and guidance to ensure you continue using the latest materials.
To find out more about this solutions details below, simply get in touch with TTS Group via the ‘Get Quote’ page or enquiry page, and we will provide you with a quote on your purchase, as well as answers to any questions.
For wafer level packaging testing (a full functional test).
2 (TP + BP) piece socket design for cost saving purpose.
Available in min 0.2mm pitch and above.
Available up to max 2500 pin count.
Package size range from min 4.4 X 5.2mm.
Protective cover (Top and Bottom) available.