Semiconductor Test Socket
Description
Solution for BGA/LGA/QFN/DFN/QFP/PGA/CMOS Image sensor package/etc.
Available in 2 (TP + BP) to 4 (GP + TP + FP + BP) piece socket design.
For Engineering / SLT / ATE test.
Specification:
Available in min 0.25mm pitch and above.
Available up to max 5000 pin count.
Socket Operating temperature from -50°C to 200°C.
Solution for BGA/LGA/QFN/DFN/QFP/PGA/CMOS Image sensor package/etc.
Available in 2 (TP + BP) to 4 (GP + TP + FP + BP) piece socket design.
For Engineering / SLT / ATE test.
Specification:
Available in min 0.25mm pitch and above.
Available up to max 5000 pin count.
Socket Operating temperature from -50°C to 200°C.
