PoP Socket
Image information
Product Description:
To test memory package separately from logic package or combined top and bottom packages
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Return Path Type Test approach: i. Socket connects topside balls to PCB through path: Top socket - Interposer - Return pin at bottom socket - PCB. ii. Bottom socket connects bottom balls to PCB. |
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Memory Direct Type Test approach: i. Top socket connects top package to topside of bottom package directly through spring pins ii. Bottom socket connects bottom package to PCB. |
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Prodcut Details
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Package Type: BGA Pin Count: 256 (Topside) / 647 (bottom) / 256 (Return) Package size: SQ14mm Min Pitch: 0.40mm Characteristic: Return Path Type. |
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Package Type : BGA Pin Count: 216 (Topside) / 617 (bottom) Min Pitch: 0.40mm Package size: SQ12mm Characteristic: Memory Direct Type. |
