As the demands for precise power delivery increase with the functionality and processing capability of today’s advanced semiconductor devices, false test failures caused by fluctuating resistance in the test circuit become more prevalent. To address this issue, many semiconductor manufacturers desire a true 4-Wire Kelvin test to maximize yield and reduce downtime however, the reduced pitch on WLCSP devices presents many challenges. TTS K-Sigma Series WLCSP Probe Heads utilize custom Kelvin contact technology to overcome these challenges and provide optimal resistance and voltage measurements on high-performance devices in both HVM wafer testing and during lab qualification. With the introduction of TTS’s new K-Sigma Series Probe Heads, our customers now have the ability to carry out full Kelvin testing of WLCSP devices down to 300um pitch. Our internally developed, custom made pins, advanced engineering materials and extensive simulations allow us to deliver a product that can increase first pass yields, reduce maintenance down time, and improve overall cost of test.

• True 4-Wire Kelvin testing on full array or selective I/O’s
• Robust probe design for long life and reduced maintenance
• Short signal length, high compliance probes
• Available manual actuator with floating alignment for singulated dies
• Easy field maintenance and probe replacement
• Tri-temp testing between -40 to 125°C
• Pitch 300μm and greater
• Suitable for WLCSP and WLBGA devices