Semiconductor Test Socket
Image information
Product Description
Solution for BGA/LGA/QFN/DFN/QFP/PGA/CMOS Image sensor package/etc.
Available in 2 (TP + BP) to 4 (GP + TP + FP + BP) piece socket design.
For Engineering / SLT / ATE test.
Specification:
Available in min 0.25mm pitch and above.
Available up to max 5000 pin count.
Socket Operating temperature from -50°C to 200°C.
Product Details
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Package Type: LGA/BGA Pitch: 1.0mm Pin Count: 4077 Characteristic: High Pin Count. For High Power SLT. |
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Package Type: BGA/LGA Pitch: 0.35mm Pin Count: 1609 Characteristic: For Handler/ATE Test. |
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Package Type: QFN
Pitch: 0.35mm Pin Count: 105 Characteristic: Standard 2 (TP + BP) pcs socket design. |
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Package Type: WLBGA
Pitch: 0.4mm Pin Count: 16 Characteristic: For Min SQ1.69mm package. Engineering test. |
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Package Type: QFP Pitch: 0.4mm Pin Count: 120 Characteristic: Standard 4 (GP+FP +TP+BP) pcs design for QFP.
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Package Type: LGA/BGA
Pitch: 0.5mm Pin Count: 86 Characteristic: With Floating Plate. Engineering test. |
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Package Type: BGA/LGA Pitch: 0.8mm Pin Count: 787 Characteristic: With Floating Plate. Engineering/ATE test.
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Package Type: BGA
Pitch: 1.0mm Pin Count: 4344 Characteristic: High Pin Count. For High Power SLT |
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Package Type: BGA Pitch: 0.4 mm Pin Count: 22 Test Height: 1.90mm Characteristic: High Bandwidth Socket. 4 pc conventional socket design with no shielding technique. For Sensor Device Test |
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