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Written by Super User on .Posted in Technical Paper

Pushing the Envelope in DFM

Prepared by Colin Koh, Paul Gunn, Muhammad Syafiq, Takuto Yoshida
Presented at BiTS Workshop, Arizona March 15 -18, 2015 & BiTS Workshop, Shanghai on October 21, 2015

Contents

  • Socket 1 Design
  • Improved Socket 2 Design
  • First FEA Simulation for Socket 2
  • FEA Simulation Improvement
  • Compare FEA Simulation and Actual Measurement
  • Improved Socket 3 Design
  • FEA Simulation Improvement
  • Compare FEA Simulation and Actual Measurement
  • Conclusion

 

Socket 1

Design

  • Total 1656 pins for 6 devices
  • 1 Top Plate (TP) Design
  • Socket side 6x M3 screws to keep TP coplanar at pin areas
  • Without FEA

Coplanarity Measurement

  • Target 0.050mm for coplanarity
  • Max. 0.116mm coplanarity from measurement
  • Warpage trend shows at center area
  • TP hardness is not enough
  • Tight screws is far from pin areas
  • FEA is required for next design

Improved Socket 1 Simulation & Measurement

  • Max. 0.129mm coplanarity from improved simulation
  • Max. 0.116mm coplanarity from measurement

Compare Socket 1 Simulation and Actual Measurement

  • Coplanarity error rate is 20% or less

Socket 2

Improved Socket 2 Design

  • Total 2370 pins for 6 devices
  • Improvements
    • Stainless Steel Holder & Ceramic Peek TP
    • 12x TP screws closer to pin area
    • Design with FEA simulation

First FEA Simulation for Socket 2

  • Coplanarity values are different in nominal and worst case
  • We estimated actual coplanarity close to nominal case

Socket 2 Coplanarity Measurement

  • Target 0.050mm for coplanarity
  • Max. 0.125mm coplanarity from measurement
  • Coplanarity measurement close to worst case
  • Need to improve the FEA

FEA Simulation Improvement

  • Implement elastic membrane technique
    • To predict deformation
    • To predict stress values
  • Elastic membrane technique provides
    • More stiffness reliability
    • More robust design
  • Refer to Prabakaranand Pal, Finite Element Analysis using Elastic Membrane Technique for Test Socket Design Optimization (BiTS, 2008)

Improved Socket 2 Simulation & Measurement

  • Max. 0.116mm coplanarity from improved simulation
  • Max. 0.125mm coplanarity from measurement

Compare Socket 2 Simulation and Actual Measurement

  • Coplanarity error rate is 19% or less

Socket 3

Improved Socket 3 Design

  • Total 2430 pins for 6 devices
  • Change TP material to Machinable Ceramic
  • Target 0.050mm for coplanarity
  • Max. 0.019mm coplanarity from improved simulation

Improved Socket 3 Simulation & Measurement

  • Max. 0.019mm coplanarity from improved simulation
  • Max. 0.023mm coplanarity from measurement

Compare Socket 3 Simulation and Actual Measurement

  • Coplanarity error rate is 21% or less

Conclusion

  • FEA simulation using Elastic Membrane technique proves good DFM relationship between design to actual socket
  • FEA provides more robust design and stiffness to enhance product reliability

Reference

Prabakaranand Pal, 2008, Finite Element Analysis using Elastic Membrane Technique for Test Socket Design Optimization, Burn-In and Test Socket Workshop, Hot Topics Session

2016

2016 Highlights

  • Consolidation of CNC production to one site for better production efficiency and cost effectiveness
  • Span off the PCB division to align with our mid to long term objective of focusing on probe pins and test socket business
2015

2015 Highlights

  • TTSG celebrates its 35 years of engineering success in the semiconductor test tooling industry. Our growth and progression have been made possible with the help and support of our stakeholders including our customers, employees, shareholders, community, and others. We would like to express our heartfelt gratitude to these individuals and institutions that have collaborated with us over the last 35 years.

    To mark this significant milestone, TTSG has launched a “Celebrating 35 Years” logo, which will appear on all TTSG’s marketing collateral.
2014

2014 Highlights

  • Test Tooling Solutions Group announced the merger and integration of Kenshi Singapore and rebrand the new entity under the Test Tooling Solutions Group, effective 1st Sept 2014.
    The merger is expected to further strengthen the core competency and technical capability of the combined unit in the provision of test and tooling solutions and to better position the Group to capture any new business opportunity, in a fast changing landscape.
    The integration exercise is expected to be completed before end of the year.
  • In line with its expansion plan, TTS Taiwan has moved to a bigger facility in Hsinchu. The new office, housing the sales, application and design centre, is within a 5 mins walking distance from the Hsinchu HSR Station. In conjunction with the Semicon Show Taiwan, the new office was officially declared open by the Group CEO and we are glad to receive our first visitor from Toshiba Japan. Our office is located at 8F-3, No.229, Fuxing 2nd Rd., Zhubei City, Hsinchu (新竹縣竹北市復興二路229號8樓之3)
  • TTSG today announces the successful registration of the company logo and tagline. The trade mark is granted under the registration number 2012018638 for a period of 10 years.
2013

2013 Highlights

  • TTSG has been granted the patent for its new probe pin design in Japan. This new probe pin design has a longer spring coil that tapered gradually to reduce stress and improve the electrical performance as well as life span of the pin.
2012

2012 Highlights

  • TTSG is pleased to introduce the new green logo and tagline- feel green, live green and be green ©
  • Received an award from Broadcom Inc in recognition of our outstanding service and support
  • TTSG has acquired another 10 units of brand new CNC machines from Citizen and Fanuc with a list price of more than USD1 million as part of the expansion plan
  • TTSG has been granted the patent for Offset Taper Spring (OTS) by the United States Patent and Trademark Office (USPTO) filed on Dec 27, 2011
2011

2011 Highlights

  • Setup secondary processing plant in JB
  • Expansion of TTS Thailand to double the capacity
  • Launch of New Corporate Branding
  • Arrival of 10 more new Citizen machines, latest model auto lathe machines from Japan as part of the overall expansion plan for 2011
  • Integration of Kenstronics Malaysia with Test Tooling Solutions Group
2010

2010 Highlights

  • Expansion of TTS Japan to a new office at Kawasaki, Kanagawa, Japan
2009

2009 Highlights

  • Launched first Intranet to enable employees to share, view and locate company/department's information
  • 5S implementation to approach for productivity, quality and safety improvement into the production floor
  • Test Tooling Solutions (TTSM) and Test Tooling Designs (TTDM) have achieved the certification of ISO 9001:2008 for Quality Systems
2008

2008 Highlights

  • Obtained the certification for RoHS (Directive 2002/95/EC on the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment) for its Test Probe
  • Acquired 100% of the R-Squared Circuits Inc, a Printed Circuit Board Manufacturer for ATE testers located in Folsom California
2007

2007 Highlights

  • Setup Auto Lathe factory in JB
  • TTSM officially took possession of Plant A in Penang
2006

2006 Highlights

  • Purchased 50,000 sq. ft of a new production facility in Johor, Malaysia
  • Completed the expansion and renovation of Plant B in Penang
  • Acquired BigHub Technology Sdn Bhd and change its name to Test Tooling Designs (M) Sdn Bhd (TTDM)
  • Established its wholly owned subsidiary in Malaysia, Test Tooling Solutions (M) Sdn. Bhd. (TTSM)
  • Incorporated Test Tooling Solutions Group Pte Ltd in Singapore (TTS Group)
  • Relocation of Corporate HQ from USA to Singapore

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