Pushing the Envelope in DFM
Prepared by Colin Koh, Paul Gunn, Muhammad Syafiq, Takuto Yoshida
Presented at BiTS Workshop, Arizona March 15 -18, 2015 & BiTS Workshop, Shanghai on October 21, 2015
Contents
- Socket 1 Design
- Improved Socket 2 Design
- First FEA Simulation for Socket 2
- FEA Simulation Improvement
- Compare FEA Simulation and Actual Measurement
- Improved Socket 3 Design
- FEA Simulation Improvement
- Compare FEA Simulation and Actual Measurement
- Conclusion
Conclusion
- FEA simulation using Elastic Membrane technique proves good DFM relationship between design to actual socket
- FEA provides more robust design and stiffness to enhance product reliability
Reference
Prabakaranand Pal, 2008, Finite Element Analysis using Elastic Membrane Technique for Test Socket Design Optimization, Burn-In and Test Socket Workshop, Hot Topics Session