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1979年以来、TTSグループは、今日の半導体テストやツールにおける困難な問題を解決することに専念し、お客様に最高のテストソリューションを提供しています。R&Dからシミュレーション、検証にいたるまで、私たちは革新性、歩留まり、品質、信頼性、そしてお客様への納期を追求し、ファイナルテストの総コストを削減することに重点を置いています。私たちはお客様のニーズを理解し、すべての懸案事項をワンストップで解決します。

  • 企業理念
    アジアにおける半導体テストツールソリューションのリーディングカンパニーであること。
  • 私たちの使命
    テストの総コストを削減し、お客様の市場投入までの時間を短縮することで、ステークホルダーの価値を創造します。

Intellectual Property & Awards

INTELLECTUAL PROPERTYAWARDS

Industrial Design of Probe Pin with Wiping Effect - Taiwan

Registration Number: D190132
Grant Date: 01/05/2018
Country: Taiwan

Probe Pin - Malaysia

Registration Number: MY-17-E0271-0101
Grant Date: 22/08/2017
Country: Malaysia

TTS Group Trademark in China Class 9

Registration Number: 19796071
Grant Date: 21/06/2017
Country: China

Hand Socket Lid - Malaysia

Specification:

  • Reducing friction to allow smoother contact between two contact surfaces
  • Enabling high compression force to be effected by a single hand pain-free

Patent Number: MY-155594-A
Grant Date: 13/11/2015
Country: Malaysia

Hand Socket Lid - US

Specification:

  • Reducing friction to allow smoother contact between two contact surfaces
  • Enabling high compression force to be effected by a single hand pain-free.

Patent Number: US 8,523,591 B2
Grant Date: 3/9/2013
Country: US

Eco Contactor

Specification:

  • Provide epoxy-sealed contactor to achieve 100% shielding factor and insulative material inserted into the contactor to prevent the signal pins from being shorted to ground.
  • Improve shielding against electromagnetic and radio frequency interference in electronic devices reduced forces for attaining and maintaining effective shielding contact

US Patent Number: : 8,210,875 B2
Grant Date: 03/07/2012
Country: US

Hybrid Contactor

Specification:

  • Provide ground plane to shield the signal pin by a middle plate embedded in between to provide a more efficient control of the impedance of the pins and reduce the inductance of power pins
  • Reduce signal mismatch during signal transmission
  • Enhance overall performance of the probe pin in supporting high data transfer rate.

Patent Number: MY-145970-A
Grant Date: 31/05/2012
Country: Malaysia

Offset Taper Spring

Specification:

  • Reducing and stabilizing the electrical resistance
  • Prolonging the lifespan of probe pin

Patent Number: US 8083552 B2
Grant Date: 27/12/ 2011
Country: US
Patent Applied & Registered in Japan & Taiwan

Single Ended Flange Probe

Specification:

  • Improve probe construction rigidity with built-in flange for preload
  • Enable low electrical contact resistance and stability with single barrel body
  • Interchangeable plunger design
  • Longer pin lifespan

Patent Number: MY – 138796 - A
Grant Date: 31/07/2009
Country: Malaysia
Patent Applied & Registered in Japan & Taiwan

Single Ended Flange Probe

Specification:

  • Improve probe construction rigidity with built-in flange for preload
  • Enable low electrical contact resistance and stability with single barrel body
  • Interchangeable plunger design
  • Longer pin lifespan

Patent Number: MY – 138796 - A
Grant Date: 31/07/2009
Country: Malaysia
Patent Applied & Registered in Japan & Taiwan

BiTS China – Best Presentation

2016
TTSG has been awarded the best presentation for our technical presentation entitled "Study of Probe Pin Internal Resistance" during BiTS China held on 13th September, 2016. The presentation shared the results of the challenges in measuring the contact resistance between the parts in probe pins.

BiTS China – Premier Sponsor for the Second Year

2016
TTSG has received an award of appreciation for being a Premier Sponsor of BiTS China in Suzhou in 2016. This marked the second year that TTS Group has been the Premier Sponsor of this prominent event to share the latest insights in test strategies in the semiconductor and related industries.

Broadcom – Award for the Best in Class Sockets & Pins

2016
TTSG was honoured by Broadcom Infrastructure Networking Group's Physical Layer (PHY) with an award in recognition of our collaboration to deliver the best in class sockets & pins. The award reflected the confidence of our customers in the quality of our sockets and pins.

BiTS - Premier Sponsor

2015
TTSG sincerely appreciate the award received from BiTS in token of being a Premier Sponsor for the event held on 21st October, 2015. We believed the opportunity given in sponsoring BiTS Workshop event has opened the door for TTSG in comprehend our current market demand and the prospect of emerging the technology by providing quality products that meet our customer’s needs.

Broadcom Award - Top 500 Company

2012
TTSG has received an award from Broadcom Inc, a fortune 500 company, in recognition of our outstanding service and support to them. The recognition is yet another affirmation of TTSG’s capability in delivering its commitment of on-time delivery and consistent quality products to support our customer’s needs.

Careers

We are a fast paced, project oriented company with multiple departments and disciplines contributing to the final product’s quality and timely delivery. In line with our company expansion, we seek dynamic individuals to fill the following positions:

 

 

Field Application Engineer (Penang)Principal Simulation Engineer (Penang)CNC Machinist (Penang)QA Inspector (Penang)Production Assistant (Penang)
Job Duties & Responsibilities:

  • Provide technical and application support to customer.
  • Prepare technical documents and specifications based on customer’s requirement.
  • Collaborate with sales, design and other relevant departments to obtain and provide accurate information for product application.
  • Identify and resolve any technical issues on customer’s test floor.

Job Requirements:

  • Possess at least a Diploma in Engineering (Electronic/Electric, Mechanical or related field).
  • At least 3 years of working experience in Test Houses in the position of Product Engineer, Production Test Engineer or Tooling Engineer.
  • Familiar with test socket, pogo pin, final test and/or WLCSP testing.
  • Customer focused with strong analytical and problem solving skills.
  • Able to communicate advanced technical concepts effectively at all levels.
  • Able to travel at short notice.
Job Duties & Responsibilities:

  • Overall lead for Simulation department and provide guidance to SI Engineer, Staff/Senior Thermal Engineer.
  • Responsible for development of robustness structural for next generation Advanced Test Technology (ATE) systems.
  • Provide technical contributions in the area of solid mechanics comprising composite material and structural behavior, mechanics of materials, fatigue and crack growth analysis, fluid-structure interaction, thermo-mechanical analysis, static and dynamic analysis, impact analysis, and design optimization.
  • Specialized in structure analysis, materials strengths and properties, design criteria, loading conditions, and processes.
  • To collect, organize, synthesize, and analyze data, summarize findings, develop conclusions and recommendations from appropriate data sources with clients, customers and/or suppliers.
  • Ensuring products achieve quality, feature set, cost, schedule, reliability, mechanical and regulatory/safety goals.
  • Develop and apply design guidelines based on project learning.
  • Ensure all project deliverables are completed in a timely manner.
  • Work closely with design/manufacturing as a team for product and components design based on given specifications.
  • Implement simulation, validation and optimization in products design and manufacturing processes.
  • Carry out any other responsibilities as and when assigned by the Management.

Job Requirements:

  • Master/Degree in Mechanical Engineering or related to Mechanical Engineering.
  • Possess at least 3 or more years of hands-on experience in Finite Element Analysis(FEA) in performing stress, mechanism, thermal or fluid dynamic analysis by using CAE software (such as SolidWorks Simulation).
  • 1 or more years of experience as a design engineer (CAD usage, tolerance analysis, failure analysis, fundamental engineering analysis).
  • Strong experience and solid fundamental understanding in mechanics of materials, stress analysis, experimental property characterization (engineering plastic), linear and non-linear finite element analysis (FEA), fatigue and structural dynamics, and thermo mechanical simulation.
  • Strong computational modeling and simulation experience with working knowledge of basic engineering calculations and principles.
  • Great aptitude for engineering analysis and solutions.
  • Ability to work independently as well as in cross-functional teams including design, simulation, engineering, production, sales, technology, test & validation and operations.

Job Duties & Responsibilities:

  • Operate CNC Drilling/Milling machines to produce the required order parts in accordance with the technical design programs provided by the CNC Programmer.
  • Perform all trained and certified processes & operations in accordance with the Company’s documented standard Working Instructions.
  • Perform the necessary regular maintenance on the CNC Drilling/Milling Machines.
  • Account for on-time completion of production jobs &  maintain Customer Quality Systems.
  • Meet management targets in terms of material wastage control, manufacturing cost reduction, system maintenance & compliance with Safety Operational.
  • Carry out any other responsibilities as and when assigned by the Management.

Job Requirements:

  • SPM, STPM, Certificate, Diploma in Manufacturing, Engineering or equivalent.
  • Minimum 2 years of related working experience in a manufacturing environment.
  • Computer literate  in MS Office Outlook, Excel, PowerPoint, Word, etc.
  • Able to handle CNC Drilling/Milling, Lathe, Cutting, Grinding, Measurement Tools
Job Duties & Responsibilities:

  • Perform daily quality checks on all incoming and outgoing products according to production delivery schedule. 
  • Report to Senior QA Engineer/QA Engineer on all defects found during inspection.
  • Update and document  QA records properly.
  • Perform proper packing for outgoing shipment.
  • Carry out any other responsibilities as and when assigned by Superior/ Management.

Job Requirements:

  • Form 3 / PMR 
  • Experience not necessary
  • Computer literate in MS Office
Job Duties & Responsibilities:

  • To assist in data entry, prepare record and perform general clerical job.
  • Ensure all data entries are accurately maintained and readily available.
  • Tabulate production data.
  • To perform other admin job when requested.
  • Carry out any other responsibilities as and when assigned by Superior / Manager.

Job Requirements:

  • SPM/Certificate education with minimum 2 years manufacturing working experience.
  • Possess good interpersonal and communication skills.
  • Attentive to details.
  • Computer literate.
  • Independent and able to meet deadlines.
  • Microsoft skills in Excel, Word and Power Point.
  • Able to start work immediately or short notice is preferred.
 

Interested applicants are invited to write-in, e-mail or fax your detailed resume stating your personal particulars, qualification, employment history, remuneration expected, contact number and a passport-sized photograph (n.r.) to:

The Human Resources Department
TEST TOOLING SOLUTIONS (M) SDN. BHD.
Plot 234, Lebuh Kampung Jawa, Free Trade Zone,
Phase 3, 11900 Bayan Lepas, Penang.
Tel: 60-4-6466966 Fax: 60-4-6462899
E-mail : このメールアドレスはスパムボットから保護されています。閲覧するにはJavaScriptを有効にする必要があります。
[Only short listed candidates will be notified.]

グローバルロケーション

 

シンガポール

本社、総務、財務・経理、営業、技術サポート

マレーシア(ペナン)

運営本部、研究開発、設計、検証評価、生産、 最終組立、品質管理

マレーシア(ジョホール)

生産

タイ

生産

米国

営業、技術サポート

日本

設計、生産、営業、技術サポート

中国

営業、技術サポート

台湾

設計、営業、技術サポート

韩国

営業

2016

2016年のハイライト

  • 生産効率とコスト効率最適化するため、CNC生産拠点を1か所に統合。
  • プローブピンとテストソケット事業に焦点を当てる中長期的な目標に合わせて、PCB部門を撤廃。
2015

2015年のハイライト

  • TTSGは、半導体テストツール業界での エンジニアリングに従事し35周年を迎えました。 私たちの成長と発展は、お客様をはじめ従業員・ 株主・そして地域社会といったステークホルダー各位のご支援の賜物と考えております。 35年間の長きにわたり、私たちにご支援いただきました方々へ感謝の意を表します。ありがとうございました。
  • 35周年のマイルストーンを機に、 TTSGはすべてのマーケティング資料に 「Celebrating 35 Years」のロゴを記載。
2014

2014年のハイライト

  • Test Tooling Solutions Groupは、2014年9月1日に、Kenshi Singaporeの合併と統合を発表し、Test Tooling Solutions Groupのもとで新しい事業体を再ブランド化しました。 この合併により、テストおよびツールソリューションの提供における中核能力と技術の強化が期待され、 さらには、急速に変化する諸環境における新しいビジネスチャンスを獲得するためのグループの位置付けが強化されることも期待されます。

    年内に完全統合する予定。
  • 事業拡大計画により、TTS台湾は新竹市の大きな施設に移転しました。営業、アプリケーション、デザインセンターを擁する新しいオフィスは、新竹(Hsinchu)HSR駅から徒歩5分以内です。
    セミコン台湾の開催に合わせて、グループCEOによって新オフィス始動が正式に宣言されました。また、新オフィスへの最初の訪問者が日本の大手半導体企業様であったことを光栄に思います。
    台湾オフィスの住所; 8F-3, No.229, Fuxing 2nd Rd., Zhubei City, Hsinchu (新竹縣竹北市復興二路229號8樓之3)
  • 本日、TTSGは会社のロゴとタグラインが登録商標権を取得したことをご報告します。

    登録商標番号2012018638で10年間付与。
2013

2013年のハイライト

  • TTSGは、新しいプローブピン設計に関する特許を 日本で取得しました。この新しいプローブピン設計は、テーパー形状を有するスプリングにより応力を低減し、ピンの寿命および電気的特性を改善。
2012

2012年のハイライト

  • TTSGは、グリーンロゴとfeel-green、live green,be green© タグラインの新規設定。
  • 優れたサービスとサポートが認められ、 Broadcom Inc社様から表彰。
  • TTSGは、拡張計画の一環として、100万ドル以上の投資をおこない、シチズン社製とファナック社製のCNCマシンを購入。
  • TTSGは、2011年12月27日に申請した「オフセットテーパースプリング(OTS)」について、米国特許商標庁(USPTO)で特許を取得。
2011

2011年のハイライト

  • ジョホールバルに二次加工工場を設立。
  • TTSタイランドの能力を2倍に拡大。
  • 新しい企業ブランディング(企業価値を高める活動)の立ち上げ。
  • 2011年の全体的な拡大計画の一環として、 シチズン社製 最新機種の自動旋盤機を10台追加。
  • Kenstronics MalaysiaとTest Tooling Solutions Group を統合。
2010

2010年のハイライト

  • 神奈川県川崎市にTTSジャパンを設立。
2009

2009年のハイライト

  • 従業員が会社/部門の情報を共有、閲覧、 検索するための最初のイントラネットを開始。
  • 生産現場での生産性・品質・安全性向上のため、 5Sアプローチを導入。
  • Test Tooling Solution(TTSM)と Test Tooling Design(TTDM)は、 品質システムのISO 9001:2008の認証を取得。
2008

2008年のハイライト

  • テストプローブ用RoHS指令(電気電子機器の特定有 害物質使用制限に関する指令2002/95 / EC)を取得。
  • カリフォルニア州フォルサムにあるATEテスターのプ リント回路基板メーカーであるR-Squared Circuits Incの100%買収。
2007

2007年のハイライト

  • ジョホールバルに自動旋盤工場を設立。
  • TTSMはペナンにA工場を正式所有。
2006

2006年のハイライト

  • マレーシアのジョホールに5万平方フィートの生産 施設を新規購入。
  • ペナンのB工場拡張と改修を完了。
  • BigHub Technology Sdn Bhdを買収し、その名称をTest Tooling Designs(M)Sdn Bhd(TTDM)に変更。
  • Test Tooling Solutions(M)Sdn Bhd (TTSM)の 完全子会社をマレーシアに設立。
  • シンガポールにTest Tooling Solutions Group Pte Ltd(TTSグループ)を設立。
  • 米国からシンガポールへ本社を移転。