Probe Pin

 

Read More

Test Socket

 

Read More

Hand Socket Lid

 

Read More

LatestNews and Events

Test Tooling Solutions (M) Sdn Bhd had been granted registration for…

The renovation work of our TTSG office in Shanghai, has been…

TTSG takes delivery of the 2 latest CNC Machining Centers from…

TTS Thailand recently organised a fire drill evacuation exercise for all…

Good day people! We are now in the renovation process of…

Pushing the Envelope in DFM

Prepared by Colin Koh, Paul Gunn, Muhammad Syafiq, Takuto Yoshida
Presented at BiTS Workshop, Arizona March 15 -18, 2015 & BiTS Workshop, Shanghai on October 21, 2015

Contents

  • Socket 1 Design
  • Improved Socket 2 Design
  • First FEA Simulation for Socket 2
  • FEA Simulation Improvement
  • Compare FEA Simulation and Actual Measurement
  • Improved Socket 3 Design
  • FEA Simulation Improvement
  • Compare FEA Simulation and Actual Measurement
  • Conclusion

 

Socket 1

Design

  • Total 1656 pins for 6 devices
  • 1 Top Plate (TP) Design
  • Socket side 6x M3 screws to keep TP coplanar at pin areas
  • Without FEA

Coplanarity Measurement

  • Target 0.050mm for coplanarity
  • Max. 0.116mm coplanarity from measurement
  • Warpage trend shows at center area
  • TP hardness is not enough
  • Tight screws is far from pin areas
  • FEA is required for next design

Improved Socket 1 Simulation & Measurement

  • Max. 0.129mm coplanarity from improved simulation
  • Max. 0.116mm coplanarity from measurement

Compare Socket 1 Simulation and Actual Measurement

  • Coplanarity error rate is 20% or less

Socket 2

Improved Socket 2 Design

  • Total 2370 pins for 6 devices
  • Improvements
    • Stainless Steel Holder & Ceramic Peek TP
    • 12x TP screws closer to pin area
    • Design with FEA simulation

First FEA Simulation for Socket 2

  • Coplanarity values are different in nominal and worst case
  • We estimated actual coplanarity close to nominal case

Socket 2 Coplanarity Measurement

  • Target 0.050mm for coplanarity
  • Max. 0.125mm coplanarity from measurement
  • Coplanarity measurement close to worst case
  • Need to improve the FEA

FEA Simulation Improvement

  • Implement elastic membrane technique
    • To predict deformation
    • To predict stress values
  • Elastic membrane technique provides
    • More stiffness reliability
    • More robust design
  • Refer to Prabakaranand Pal, Finite Element Analysis using Elastic Membrane Technique for Test Socket Design Optimization (BiTS, 2008)

Improved Socket 2 Simulation & Measurement

  • Max. 0.116mm coplanarity from improved simulation
  • Max. 0.125mm coplanarity from measurement

Compare Socket 2 Simulation and Actual Measurement

  • Coplanarity error rate is 19% or less

Socket 3

Improved Socket 3 Design

  • Total 2430 pins for 6 devices
  • Change TP material to Machinable Ceramic
  • Target 0.050mm for coplanarity
  • Max. 0.019mm coplanarity from improved simulation

Improved Socket 3 Simulation & Measurement

  • Max. 0.019mm coplanarity from improved simulation
  • Max. 0.023mm coplanarity from measurement

Compare Socket 3 Simulation and Actual Measurement

  • Coplanarity error rate is 21% or less

Conclusion

  • FEA simulation using Elastic Membrane technique proves good DFM relationship between design to actual socket
  • FEA provides more robust design and stiffness to enhance product reliability

Reference

Prabakaranand Pal, 2008, Finite Element Analysis using Elastic Membrane Technique for Test Socket Design Optimization, Burn-In and Test Socket Workshop, Hot Topics Session

TESTIMONIALS

Price is lower, and the quality is good, compare the other product...in this price, the quality is good... I'm very happy to use your product...
Andy YangSnr Staff Engineer - Broadcom
Innovativeness, cost effectiveness and agility is the most important things we look for ...even after leaving Intel, I will always recommend TTS and will continue to do so.
Ashoke SethFormer Director - Intel
TTS socket is easy to use, great to put on, easy to remove and replace from board to board...
Paul WilliamsEngineering Tech - Broadcom
The reason to purchase TTS socket is not only low cost but high quality... perform in lab and to temperature testing.
Dale RasmusenPrincipal Engineer - Teknovus
...repeatability from trial to trial, and all in all, we have good support, certainly a robust product, so we are happy with it.
Christian WiherSenior Principal Engineer - Broadcom
The quality and design of sockets and pins are very good, my customers and business units are happy with the sockets. With that obviously we prefer TTS.
Errol MonsaleTest Hardware Engineer - IDT
The technology of TTS is novel and leading edge. I am excited from the information that is provided from this high technology company.
Akira NagashimaDirector - Toshiba
We are happy working with the Japanese team with great support. Let’s grow together.
SaitoDirector - Elia

WHAT'S INTERESTING

CAPABILITIES

PATENTS & AWARDS

CSR