Package Type: QFN
Design for impedance matching and shielding to improve test performance using conductive medium.
Ground pin is shorted to a conductive body.
Signal pin is isolated from the conductive body
Same pins are used for power and ground, different from signal pin.
Socket with Metal Block Design
Design to shield test environment and improve socket SI performance.
Contact with package and PCB ground to achieve good isolation between signal pins.
Package size: SQ2mm to SQ6mm
Package pad minimum pitch: 0.5mm to 0.65mm
Package lead count: 12 to 36
Test frequency: 3GHz to 6GHz
Insertion loss: -0.5 to -0.7dB
Return loss: -30dB
Isolation: -50dB to -75dB